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Physical Vapor Desposition Tool

This is an animation of a generic PVD tool to deposit copper onto silicon wafers.

The plasma etches tiny copper particles off of the target, which then fall down onto the wafer and adhere on the surface. The plasma ionizes the particles and the charged electrostatic chuck helps ensure that the particles fall perpendicular to the wafer surface and as uniformly as possible.

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Posted by: Linas Gluosnis
October 6th, 2010 at 23:16
 

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