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MEMS Technology to Be Featured at Sensors Expo & Conference

MEMS, or microelectromechanical systems, will be a key technology featured in the educational sessions and throughout the Expo Hall during the 2012 Sensors Expo & Conference. The largest showcase of sensors and sensing technologies will be taking place June 6-7 at the Donald E. Stephens Convention Center in Rosemont, IL.

“We are proud of our history and our focus on cutting edge technology by partnering with the MEMS Industry Group and others,” said Wendy Loew, Group Show Director for Questex Media Group, LLC, producers of Sensors Expo. “Since 1987, when the industry was just in its infancy, we have been bringing together the industry leaders like Epson, ROHM, PCB Piezotronics, and MicroStrain to share the newest technologies with engineers who are providing the solutions for tomorrow.”

For over 25 years, Sensors Expo has been the only industry event focused exclusively on sensors and sensor-integrated systems, bringing engineering professionals the latest trends and technologies in sensors. This year will be no different, with a focus on cutting edge MEMS technology throughout the Expo and Conference program.

Beginning Tuesday, June 5, the MEMS education at Sensors Expo will kick off with a Pre-Conference Workshop titled “MEMS in the Mainstream: Commercialization and Product Realization — Leveraging the MEMS Infrastructure” in partnership with MEMS Industry Group (MIG), the leading trade association advancing MEMS across global markets. This pre-conference symposium will explore the many models of achieving MEMS commercialization and product realization. System-level customers attending this pre-conference will learn how to leverage a mature MEMS infrastructure capable of delivering system-level components without the cost, development time or performance risks of years past. Speakers will discuss how MEMS fabrication has evolved, creating a new era of in-house fabrication as well as fabless and fab-lite manufacturing. Presentations will include different perspectives on how companies have incorporated MEMS solutions into their current product line — while using their existing infrastructure. They will also address the product development challenges and the market-pull vs. technology-push issues that are unique to MEMS. In other words, MEMS is in the mainstream.

The in-depth conference program will showcase over 55 sessions during the two day event, including a dedicated MEMS track with 9 sessions. Specific MEMS sessions include:

•Sensor Fusion: Applications, Challenges and Solutions
Stephane Gervais-Ducouret, Director for Sensors, Freescale
•An Integrated 6-axis MotionProcessor
Stephen Lloyd, Vice President of Engineering and New Product Development, InvenSense, Inc.
•MEMS in High Performance Audio

Rob OReilly, Senior Staff Engineer, Analog Devices Inc.
As part of the main conference program on Wednesday, June 6 Assaf Biderman will present the Opening Keynote: A Human-Computer-City Interface, discussing how new digital technologies allow individuals to monitor the city they live in. Wednesday, June 6 and Thursday, June 7, industry experts will lead discussions on sensors technology in nine tracks:

•MEMS
•Energy Harvesting
•Wireless Sensing Solutions
•Sensor and System Design
•Novel Approaches to Measurement & Detection
•Big Data & Analytics
•Mobile Sensing
•RFID/M2M
•Applied Sensors

In addition to the robust conference programming dedicated to MEMS, Sensors Expo will also provide a grand showcase of the newest MEMS products and services as well as education on what is to come at the only MEMS Pavilion. The MEMS Pavilion will display best-in-class exhibitors: Advanced Microsensors, Fraunhofer ENAS, Fraunhofer IPMS, Omron, STMicroelectronics, Tronic MEMS, X-Fab, and Yole Development, all dedicated to providing the latest in MEMS technologies. Inside the pavilion, the MEMS Innovation Area will be dedicated to companies who are on the forefront of strategic MEMS products, such as MEMS Industry Group, Acuity, Hua Yank and Plures Technologies.

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Posted by: VCi News Desk 
March 27th, 2012 at 19:20
 

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